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Taiwan / US / Korea · Chips & Networking

Leading-Edge Chipmaking (Foundry)

One company produces almost all leading-edge AI logic. N3/N2 capacity is allocated years ahead and every new fab is a multi-year, tens-of-billions bet.

EUV + tools→Wafer starts→Leading-node logic→Packaging
84
Tightness score ⓘ
#6 of 56
▲ Tightening
Supply concentration5
Lead time5
Capex intensity5
Geopolitical exposure5
Pricing power5
Lead time
24–36 mo
Theme 1M
−16.6%
% in uptrend
0%
Metric to watch

TSMC monthly revenue, N2 ramp commentary, and capex guidance revisions.

What would prove us wrong

Weakens if leading-node utilisation falls while packaging and HBM stay loose — logic would no longer bind.

Foundry theme performance

Equal-weight · rebased 100 · 1Y
Stocks we track

Who controls this bottleneck

Roles, not recommendations. Delayed prices; local currency.

StockRoleListingLast1D1M3MYTDOff 52w highTrendNext earnings
TSM
Taiwan Semiconductor
Leading-node foundry and CoWoS packaging chokepoint NYSE
Taiwan
$425.4 +1.64% −5.6% +8.7% +41.1% −12.4% 2027-01-14
INTC
Intel
US foundry rebuild with advanced-packaging optionality NASDAQ
US
$90.78 +4.39% −26.2% +5.2% +146.0% −35.6% 2026-10-29
005930.KS
Samsung Electronics
HBM, DRAM and foundry across memory and logic KRX
Korea
₩213,000 −1.16% −22.3% −18.2% +78.2% −41.2% 2026-10-28
GFS
GlobalFoundries
Specialty-node foundry incl. silicon photonics NASDAQ
US
$45.34 +2.14% −7.5% −7.3% +30.4% −49.4% 2026-11-04
UMC
United Microelectronics
Mature-node foundry and interposer capacity NYSE
Taiwan
$19.14 +1.30% −21.3% +10.2% +147.7% −30.5% 2026-10-28