Japan / Taiwan · Chips & Networking
Chip Substrates (ABF & Glass)
Large AI packages need big, many-layer ABF substrates. The build-up film itself comes from one supplier; glass-core substrates are the next transition.
ABF film→Core→Build-up layers→Package
64
Tightness score ⓘ
#30 of 56
▲ Tightening
Lead time
12–24 mo
Theme 1M
+0.1%% in uptrend
25%Metric to watch
Ibiden/Unimicron capacity adds, ABF film supply commentary, and glass-core qualification news.
What would prove us wrong
Weakens if substrate makers report utilisation falling while AI package sizes keep growing.
Dependencies
Substrates theme performance
Equal-weight · rebased 100 · 1YStocks we track
Who controls this bottleneck
Roles, not recommendations. Delayed prices; local currency.
| Stock | Role | Listing | Last | 1D | 1M | 3M | YTD | Off 52w high | Trend | Next earnings |
|---|---|---|---|---|---|---|---|---|---|---|
| 4062.T Ibiden |
High-end ABF substrates for AI accelerators | TSE Japan |
¥8,248.0 | −3.10% | −26.3% | −9.5% | +145.8% | −37.5% | 2026-10-29 | |
| 3037.TW Unimicron |
ABF substrate capacity | TWSE Taiwan |
NT$1,085.0 | 0.00% | +6.4% | +21.1% | +394.2% | −18.1% | 2026-10-27 | |
| 8046.TW Nan Ya PCB |
ABF substrates | TWSE Taiwan |
NT$1,265.0 | 0.00% | +19.3% | +2.9% | +426.0% | −15.9% | — | |
| 2802.T Ajinomoto |
Sole major supplier of ABF build-up film | TSE Japan |
¥5,013.0 | −1.01% | +0.8% | −4.1% | +52.7% | −18.4% | 2026-11-09 |