3037.TW Unimicron
ABF substrate capacity
Fundamentals from public market data, refreshed daily (2026-10-26 21:24 UTC). Figures in reporting currency.
3037.TW · price with what management and the data said
Timeline: management commentary, data & earnings
8 events-
8
2026-07-28EarningsBeat / raise
Reported EPS 8.38 vs 3.49 expected (+140.4% surprise).
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7
2026-04-28EarningsBeat / raise
Reported EPS 3 vs 2 expected (+50.1% surprise).
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6
2026-02-25EarningsBeat / raise
Reported EPS 2.29 vs 1.54 expected (+48.9% surprise).
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5
2025-10-28EarningsBeat / raise
Reported EPS 1.43 vs 1.35 expected (+5.7% surprise).
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4
2025-07-28EarningsMiss / cut
Reported EPS 0.62 vs 0.68 expected (-9.3% surprise).
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3
2025-04-22EarningsMiss / cut
Reported EPS 0.6 vs 0.67 expected (-10.4% surprise).
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2
2025-02-24EarningsMiss / cut
Reported EPS 0.03 vs 1.26 expected (-97.6% surprise).
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1
2024-10-29EarningsMiss / cut
Reported EPS 0.65 vs 1.36 expected (-52.3% surprise).
Latest headlines
Auto-updated dailyEarnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-07-28 | 3.49 | 8.38 | +140.4% |
| 2026-04-28 | 2.0 | 3.0 | +50.1% |
| 2026-02-25 | 1.54 | 2.29 | +48.9% |
| 2025-10-28 | 1.35 | 1.43 | +5.7% |
| 2025-07-28 | 0.68 | 0.62 | −9.3% |
| 2025-04-22 | 0.67 | 0.6 | −10.4% |
| 2025-02-24 | 1.26 | 0.03 | −97.6% |
| 2024-10-29 | 1.36 | 0.65 | −52.3% |
| 2024-07-29 | 1.12 | 1.04 | −7.2% |
| 2024-04-22 | 1.21 | 1.59 | +31.6% |
| 2024-02-26 | 1.7 | 1.9 | +12.0% |
| 2023-10-23 | 1.62 | 1.69 | +4.5% |
| 2023-07-27 | 1.41 | 1.56 | +10.7% |
| 2023-04-25 | 2.87 | 2.68 | −6.6% |
| 2023-02-22 | 5.31 | 4.66 | −12.2% |
| 2022-10-27 | 5.34 | 5.63 | +5.5% |
| 2022-07-28 | 4.36 | 5.37 | +23.1% |
| 2022-04-28 | 3.32 | 3.83 | +15.5% |
| 2022-02-22 | 2.73 | 3.36 | +23.2% |
| 2021-10-25 | 1.86 | 2.85 | +52.9% |
| 2021-07-26 | 1.03 | 1.24 | +20.7% |
| 2021-04-27 | 0.7 | 1.48 | +110.3% |
| 2021-02-22 | 0.61 | 1.39 | +127.5% |
| 2020-10-27 | 1.0 | 1.09 | +9.4% |
About Unimicron
Website ↗Unimicron Technology Corp., together with its subsidiaries, engages in the manufacturing, processing, and sale of printed circuit boards, electrical equipment, electronic products, and integrated circuit product testing and burn-in systems in Taiwan, China, Asia, the Americas, and internationally. The company offers PCB products, including HDI, ELIC, multi-layer and rigid flex PCBs, and FPC; IC carriers, such as FCCSP, FCBGA, CSP, memory module, and coreless; connectors comprising PCBeam and X-Beam; TP and ECRM, which include glass and film type, as well as EC mirror; and design and sim services, such as EDA profile and thermo-mech solutions. It is also involved in food and beverage business; food manufacturing and sale; trading activities; business management consulting; product inspection; property management; and lighting product manufacturing and sale. The company was incorporated in…
Large AI packages need big, many-layer ABF substrates. The build-up film itself comes from one supplier; glass-core substrates are the next transition.
What would prove us wrong. Weakens if substrate makers report utilisation falling while AI package sizes keep growing.
Who else supplies this
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.