042700.KS Hanmi Semiconductor
TC bonders for HBM stacking
Fundamentals from public market data, refreshed daily (2026-10-24 02:59 UTC). Figures in reporting currency.
042700.KS · price with what management and the data said
Timeline: management commentary, data & earnings
8 events-
8
2026-08-14EarningsBeat / raise
Reported EPS 1138 vs 997.82 expected (+14.1% surprise).
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7
2026-05-15EarningsMiss / cut
Reported EPS 200 vs 920.42 expected (-78.3% surprise).
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6
2026-03-12EarningsMiss / cut
Reported EPS 303 vs 464.41 expected (-34.8% surprise).
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5
2025-11-14EarningsMiss / cut
Reported EPS 690 vs 772.13 expected (-10.6% surprise).
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4
2025-08-14EarningsMiss / cut
Reported EPS 680 vs 713.03 expected (-4.6% surprise).
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3
2025-05-15EarningsMiss / cut
Reported EPS 575 vs 627.49 expected (-8.4% surprise).
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2
2025-03-13EarningsMiss / cut
Reported EPS 588 vs 843.25 expected (-30.3% surprise).
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1
2024-11-14EarningsMiss / cut
Reported EPS 399 vs 767.12 expected (-48.0% surprise).
Latest headlines
Auto-updated dailyEarnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-08-14 | 997.82 | 1138.0 | +14.1% |
| 2026-05-15 | 920.42 | 200.0 | −78.3% |
| 2026-03-12 | 464.41 | 303.0 | −34.8% |
| 2025-11-14 | 772.13 | 690.0 | −10.6% |
| 2025-08-14 | 713.03 | 680.0 | −4.6% |
| 2025-05-15 | 627.49 | 575.0 | −8.4% |
| 2025-03-13 | 843.25 | 588.0 | −30.3% |
| 2024-11-14 | 767.12 | 399.0 | −48.0% |
| 2024-08-14 | 485.08 | -123.0 | −125.4% |
| 2010-05-14 | 17.6 | 26.8 | +52.3% |
| 2010-03-23 | 4.6 | 13.0 | +182.6% |
| 2010-03-18 | 1.8 | 35.8 | +1888.9% |
| 2009-08-13 | -2.4 | 1.0 | +141.7% |
| 2009-05-15 | 6.63 | 8.8 | +32.8% |
| 2009-04-23 | 13.2 | -5.2 | −139.4% |
| 2008-12-01 | 59.6 | 17.6 | −70.5% |
| 2008-08-14 | 33.6 | 19.4 | −42.3% |
| 2008-05-14 | 39.4 | 28.6 | −27.4% |
| 2008-01-30 | 38.86 | 27.6 | −29.0% |
| 2007-10-29 | 50.48 | 78.4 | +55.3% |
| 2007-04-16 | 83.24 | 52.57 | −36.8% |
About Hanmi Semiconductor
Website ↗HANMI Semiconductor Co., Ltd. manufactures and sells semiconductor equipment in South Korea and internationally. The company offers bonder; micro SAW equipment; vision placement equipment; meta grinder; EMI shield vision attach and detach, EMI shield vision placement, EMI shield tape mounter, EMI shield tape laser cutting, EMI shield tape demounter, vision inspection, and converlay attach equipment; laser marking, laser ablation, and laser cutting equipment; and pick and place, strip mounter, and vision inspection equipment. HANMI Semiconductor Co., Ltd. was founded in 1980 and is based in Incheon, South Korea.
An accelerator is useless until logic and HBM are integrated on an interposer. 2.5D/3D capacity, hybrid bonders and TC bonders gate output.
What would prove us wrong. Weakens if CoWoS expansions run ahead of accelerator demand and OSAT utilisation drops.
Who else supplies this
| Stock | Role | Last | 1D | 1M | YTD | Trend |
|---|---|---|---|---|---|---|
| TSM Taiwan Semiconductor | Leading-node foundry and CoWoS packaging chokepoint | $427.1 | +2.06% | −5.2% | +41.7% | |
| ASX ASE Technology | Largest OSAT; takes CoWoS-class overflow | $40.16 | +3.79% | −9.4% | +151.9% | |
| AMKR Amkor Technology | Advanced packaging OSAT incl. US capacity | $38.11 | −3.03% | −28.9% | −3.0% | |
| BESI.AS BE Semiconductor | Hybrid bonding equipment leader | €146.3 | +0.86% | −22.0% | +10.1% | |
| 6146.T Disco | Dicing and grinding for thin wafers and HBM | ¥48,410 | −1.79% | −8.9% | +1.4% |
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.