6146.T Disco
Dicing and grinding for thin wafers and HBM
Fundamentals from public market data, refreshed daily (2026-10-24 02:59 UTC). Figures in reporting currency.
6146.T · price with what management and the data said
Timeline: management commentary, data & earnings
8 events-
8
2026-10-22EarningsMiss / cut
Reported EPS 425.33 vs 459.93 expected (-7.5% surprise).
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7
2026-07-23EarningsMiss / cut
Reported EPS 315.51 vs 323.24 expected (-2.4% surprise).
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6
2026-04-22EarningsBeat / raise
Reported EPS 395.42 vs 335.4 expected (+17.9% surprise).
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5
2026-01-21EarningsBeat / raise
Reported EPS 338.72 vs 287.01 expected (+18.0% surprise).
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4
2025-10-29EarningsMiss / cut
Reported EPS 296.47 vs 305.33 expected (-2.9% surprise).
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3
2025-07-17EarningsBeat / raise
Reported EPS 219.23 vs 203.94 expected (+7.5% surprise).
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2
2025-04-16EarningsBeat / raise
Reported EPS 356.52 vs 332.54 expected (+7.2% surprise).
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1
2025-01-23EarningsMiss / cut
Reported EPS 293.54 vs 300.17 expected (-2.2% surprise).
Latest headlines
Auto-updated daily- Did Strong Q2 Sales and an Upgraded Zacks Rank Just Shift Disco's (TSE:6146) Investment Narrative?2026-10-10
- What Makes DISCO CORP (DSCSY) a New Strong Buy Stock2026-10-09
- Has DISCO CORP (DSCSY) Outpaced Other Industrial Products Stocks This Year?2026-10-08
- Disco Reports Preliminary Second-Quarter Revenue Up 39% Year Over Year2026-10-06
- New DISCO Auto Review Capability Puts Legal Teams in Control of AI-Powered Review2026-08-20
- DISCO Launches Advanced Research for Deep, Agentic AI Powered eDiscovery and Fact Investigation2026-08-13
- Are Industrial Products Stocks Lagging DISCO CORP (DSCSY) This Year?2026-04-02
Earnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-10-22 | 459.93 | 425.33 | −7.5% |
| 2026-07-23 | 323.24 | 315.51 | −2.4% |
| 2026-04-22 | 335.4 | 395.42 | +17.9% |
| 2026-01-21 | 287.01 | 338.72 | +18.0% |
| 2025-10-29 | 305.33 | 296.47 | −2.9% |
| 2025-07-17 | 203.94 | 219.23 | +7.5% |
| 2025-04-16 | 332.54 | 356.52 | +7.2% |
| 2025-01-23 | 300.17 | 293.54 | −2.2% |
| 2024-10-16 | 281.56 | 274.35 | −2.6% |
| 2024-07-18 | 253.36 | 218.85 | −13.6% |
| 2024-04-24 | 297.93 | 326.99 | +9.8% |
| 2024-01-23 | 176.28 | 148.34 | −15.8% |
| 2023-10-18 | 195.81 | 184.87 | −5.6% |
| 2023-07-19 | 148.84 | 117.09 | −21.3% |
| 2023-04-19 | 189.41 | 237.05 | +25.1% |
| 2023-01-23 | 175.52 | 152.78 | −12.9% |
| 2022-10-19 | 210.09 | 227.49 | +8.3% |
| 2022-07-20 | 159.38 | 148.14 | −7.0% |
| 2022-04-20 | 160.6 | 191.18 | +19.0% |
| 2022-01-24 | 147.15 | 156.26 | +6.2% |
| 2021-10-20 | 142.57 | 166.42 | +16.7% |
| 2021-07-19 | 110.18 | 97.82 | −11.2% |
| 2021-04-21 | 104.2 | 124.57 | +19.5% |
| 2021-01-25 | 78.4 | 83.53 | +6.5% |
About Disco
Website ↗Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company offers precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, inspection systems, surface planers, and waterjet saws. It also provides precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, the company is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, it leases precision machines; and purchases and sells used machines. Additionally, the company manufactures and sells precision diamond abrasive tools; and offer…
An accelerator is useless until logic and HBM are integrated on an interposer. 2.5D/3D capacity, hybrid bonders and TC bonders gate output.
What would prove us wrong. Weakens if CoWoS expansions run ahead of accelerator demand and OSAT utilisation drops.
Who else supplies this
| Stock | Role | Last | 1D | 1M | YTD | Trend |
|---|---|---|---|---|---|---|
| TSM Taiwan Semiconductor | Leading-node foundry and CoWoS packaging chokepoint | $427.1 | +2.06% | −5.2% | +41.7% | |
| ASX ASE Technology | Largest OSAT; takes CoWoS-class overflow | $40.16 | +3.79% | −9.4% | +151.9% | |
| AMKR Amkor Technology | Advanced packaging OSAT incl. US capacity | $38.11 | −3.03% | −28.9% | −3.0% | |
| BESI.AS BE Semiconductor | Hybrid bonding equipment leader | €146.3 | +0.86% | −22.0% | +10.1% | |
| 042700.KS Hanmi Semiconductor | TC bonders for HBM stacking | ₩184,000 | −3.66% | −22.2% | +44.9% |
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.