BESI.AS BE Semiconductor
Hybrid bonding equipment leader
Fundamentals from public market data, refreshed daily (2026-10-24 02:59 UTC). Figures in reporting currency.
BESI.AS · price with what management and the data said
Timeline: management commentary, data & earnings
8 events-
8
2026-10-22EarningsBeat / raise
Reported EPS 1.33 vs 1.31 expected (+1.9% surprise).
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7
2026-07-23EarningsMiss / cut
Reported EPS 1.11 vs 1.14 expected (-2.4% surprise).
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6
2026-04-23EarningsMiss / cut
Reported EPS 0.65 vs 0.65 expected (-0.4% surprise).
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5
2026-02-19EarningsBeat / raise
Reported EPS 0.54 vs 0.51 expected (+5.7% surprise).
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4
2025-10-23EarningsBeat / raise
Reported EPS 0.32 vs 0.31 expected (+1.9% surprise).
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3
2025-07-24EarningsMiss / cut
Reported EPS 0.4 vs 0.46 expected (-12.6% surprise).
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2
2025-04-23EarningsBeat / raise
Reported EPS 0.4 vs 0.39 expected (+1.3% surprise).
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1
2025-02-20EarningsBeat / raise
Reported EPS 0.74 vs 0.59 expected (+25.2% surprise).
Latest headlines
Auto-updated dailyEarnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-10-22 | 1.31 | 1.33 | +1.9% |
| 2026-07-23 | 1.14 | 1.11 | −2.4% |
| 2026-04-23 | 0.65 | 0.65 | −0.4% |
| 2026-02-19 | 0.51 | 0.54 | +5.7% |
| 2025-10-23 | 0.31 | 0.32 | +1.9% |
| 2025-07-24 | 0.46 | 0.4 | −12.6% |
| 2025-04-23 | 0.39 | 0.4 | +1.3% |
| 2025-02-20 | 0.59 | 0.74 | +25.2% |
| 2024-10-24 | 0.54 | 0.59 | +8.5% |
| 2024-07-25 | 0.51 | 0.53 | +3.1% |
| 2024-04-25 | 0.47 | 0.44 | −7.3% |
| 2024-02-22 | 0.6 | 0.68 | +13.6% |
| 2023-10-26 | 0.47 | 0.45 | −3.4% |
| 2023-07-27 | 0.61 | 0.66 | +7.7% |
| 2023-04-26 | 0.39 | 0.44 | +12.9% |
| 2023-02-22 | 0.52 | 0.5 | −4.0% |
| 2022-10-20 | 0.63 | 0.69 | +9.8% |
| 2022-07-21 | 0.98 | 0.9 | −7.9% |
| 2022-04-29 | 0.79 | 0.89 | +12.5% |
| 2022-02-18 | 0.74 | 0.76 | +2.2% |
| 2021-10-26 | 1.03 | 1.0 | −3.3% |
| 2021-07-27 | 0.84 | 1.12 | +33.0% |
| 2021-04-30 | 0.56 | 0.55 | −0.9% |
| 2021-02-19 | 0.33 | 0.55 | +66.7% |
About BE Semiconductor
Website ↗BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems; and conventional, ultra-thin and wafer level molding, trim and form, and singulation systems. It also provides tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company sells its products under the Fico, Meco, Datacon, and Esec brands. It serves multination…
An accelerator is useless until logic and HBM are integrated on an interposer. 2.5D/3D capacity, hybrid bonders and TC bonders gate output.
What would prove us wrong. Weakens if CoWoS expansions run ahead of accelerator demand and OSAT utilisation drops.
Who else supplies this
| Stock | Role | Last | 1D | 1M | YTD | Trend |
|---|---|---|---|---|---|---|
| TSM Taiwan Semiconductor | Leading-node foundry and CoWoS packaging chokepoint | $427.1 | +2.06% | −5.2% | +41.7% | |
| ASX ASE Technology | Largest OSAT; takes CoWoS-class overflow | $40.16 | +3.79% | −9.4% | +151.9% | |
| AMKR Amkor Technology | Advanced packaging OSAT incl. US capacity | $38.11 | −3.03% | −28.9% | −3.0% | |
| 042700.KS Hanmi Semiconductor | TC bonders for HBM stacking | ₩184,000 | −3.66% | −22.2% | +44.9% | |
| 6146.T Disco | Dicing and grinding for thin wafers and HBM | ¥48,410 | −1.79% | −8.9% | +1.4% |
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.