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NASDAQ · US · Semiconductor Equipment & Materials

AMAT Applied Materials

Deposition and materials engineering across logic, DRAM and packaging

Downtrend Trading below its 50-day average. (automatic: supply-chain trend + price vs 50-day average)
Last close (delayed) · 2026-10-26
$391.6
+3.81% today
1W
−5.2%
1M
−19.3%
3M
−17.7%
YTD
+52.9%
1Y
+72.1%
Off 52w high
−45.8%
Next earnings (est.): 2026-11-12
Market cap$299B
P/E (trailing)32.5Forward 20.4
EV / sales9.6×EV/EBITDA 29.2×
Revenue (TTM)$30.84BGrowth 24.8% y/y
Margins49.4%gross · op 33.7%
Free cash flow$3.08BCash $9.23B · debt $7.35B
Analyst target$627.8+60.3% upside · 36 analysts · strong buy
Riskβ 1.59Short 1.7% of float · yield 0.56%

Fundamentals from public market data, refreshed daily (2026-10-24 02:59 UTC). Figures in reporting currency.

AMAT · price with what management and the data said

Supply tighteningBeat / raiseMiss / cutData releaseEasing Hover a numbered marker for details · dashed lines = 50- and 200-day averages

Timeline: management commentary, data & earnings

8 events
  1. 8
    2026-08-13EarningsBeat / raise

    Reported EPS 3.5 vs 3.39 expected (+3.1% surprise).

  2. 7
    2026-05-14EarningsBeat / raise

    Reported EPS 2.86 vs 2.69 expected (+6.5% surprise).

  3. 6
    2026-02-12EarningsBeat / raise

    Reported EPS 2.38 vs 2.21 expected (+7.9% surprise).

  4. 5
    2025-11-13EarningsBeat / raise

    Reported EPS 2.17 vs 2.09 expected (+3.6% surprise).

  5. 4
    2025-08-14EarningsBeat / raise

    Reported EPS 2.48 vs 2.36 expected (+5.1% surprise).

  6. 3
    2025-05-15EarningsBeat / raise

    Reported EPS 2.39 vs 2.31 expected (+3.5% surprise).

  7. 2
    2025-02-13EarningsBeat / raise

    Reported EPS 2.38 vs 2.3 expected (+3.7% surprise).

  8. 1
    2024-11-14EarningsBeat / raise

    Reported EPS 2.32 vs 2.19 expected (+5.7% surprise).

Predictions involving AMAT

Earnings history

EPS vs expectations
DateExpected EPSReported EPSSurprise
2026-08-133.393.5+3.1%
2026-05-142.692.86+6.5%
2026-02-122.212.38+7.9%
2025-11-132.092.17+3.6%
2025-08-142.362.48+5.1%
2025-05-152.312.39+3.5%
2025-02-132.32.38+3.7%
2024-11-142.192.32+5.7%
2024-08-152.032.12+4.7%
2024-05-161.992.09+5.3%
2024-02-151.912.13+11.8%
2023-11-161.992.12+6.4%
2023-08-171.751.9+8.9%
2023-05-181.832.0+9.5%
2023-02-161.922.03+5.7%
2022-11-171.742.03+16.9%
2022-08-181.781.94+8.7%
2022-05-191.91.85−2.8%
2022-02-161.851.89+1.9%
2021-11-181.961.94−0.9%
2021-08-191.781.9+6.8%
2021-05-201.511.63+7.9%
2021-02-181.281.39+8.8%
2020-11-121.171.25+6.7%

About Applied Materials

Website ↗

Applied Materials, Inc. provides materials engineering solutions, equipment, services, and software to the semiconductor and related industries in the United States, China, Korea, Taiwan, Japan, Southeast Asia, Europe, and internationally. The company operates through Semiconductor Systems and Applied Global Services (AGS) segments. The Semiconductor Systems segment includes semiconductor capital equipment to enable materials engineering steps, including etch, rapid thermal processing, deposition, chemical mechanical planarization, metrology and inspection, wafer packaging, and ion implantation. The AGS segment offers integrated solutions to optimize equipment and fab performance and productivity comprising spares, upgrades, services, and 200 millimeter and other equipment and factory automation software for semiconductor and other products. It serves manufacturers of semiconductor wafer…

38,900 employees · Santa Clara, United States

Gate-all-around transistors, backside power and HBM stacking add process steps. More steps per wafer means more tool spend per unit of capacity.

Deposition→Etch→Inspection→Yield

What would prove us wrong. Weakens if WFE growth stalls while leading-node and HBM capacity keep expanding — tools would not be the gate.

Peers at the same bottleneck

Who else supplies this

StockRoleLast1D1MYTDTrend
LRCX
Lam Research
Etch and deposition critical for GAA and HBM $239.8+4.22%−23.9%+40.5%
KLAC
KLA
Process control and inspection at leading nodes $150.4+3.27%−20.0%+24.2%
8035.T
Tokyo Electron
Coater/developer, etch and deposition tools ¥9,110.0−3.68%−12.5%+38.7%
ASM.AS
ASM International
ALD/epitaxy for gate-all-around transistors €707.8+1.14%−16.2%+37.3%
ONTO
Onto Innovation
Advanced-packaging metrology and lithography $205.6+3.48%−28.5%+30.2%
CAMT
Camtek
Inspection for HBM and advanced packaging $124.9+3.09%−15.1%+17.4%
NVMI
Nova
Dimensional and materials metrology $318.4+2.27%−13.5%−3.0%

Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.