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NYSE · US · Semiconductor Equipment & Materials

ONTO Onto Innovation

Advanced-packaging metrology and lithography

Downtrend Trading below its 50-day average. (automatic: supply-chain trend + price vs 50-day average)
Last close (delayed) · 2026-10-26
$205.6
+3.48% today
1W
−9.1%
1M
−28.5%
3M
−15.0%
YTD
+30.2%
1Y
+52.7%
Off 52w high
−45.7%
Next earnings (est.): 2026-11-09
Market cap$9.75B
P/E (trailing)74.7Forward 17.0
EV / sales8.3×EV/EBITDA 30.2×
Revenue (TTM)$1.12BGrowth 35.3% y/y
Margins55.5%gross · op 23.0%
Free cash flow$203MCash $1.88B · debt $1.47B
Analyst target$383.3+86.4% upside · 12 analysts · strong buy
Riskβ 1.58Short 7.7% of float

Fundamentals from public market data, refreshed daily (2026-10-24 02:59 UTC). Figures in reporting currency.

ONTO · price with what management and the data said

Supply tighteningBeat / raiseMiss / cutData releaseEasing Hover a numbered marker for details · dashed lines = 50- and 200-day averages

Timeline: management commentary, data & earnings

8 events
  1. 8
    2026-08-06EarningsBeat / raise

    Reported EPS 1.93 vs 1.69 expected (+14.2% surprise).

  2. 7
    2026-05-05EarningsBeat / raise

    Reported EPS 1.42 vs 1.42 expected (+0.3% surprise).

  3. 6
    2026-02-19EarningsMiss / cut

    Reported EPS 1.26 vs 1.26 expected (-0.2% surprise).

  4. 5
    2025-11-06EarningsBeat / raise

    Reported EPS 0.92 vs 0.87 expected (+5.9% surprise).

  5. 4
    2025-08-07EarningsMiss / cut

    Reported EPS 1.25 vs 1.28 expected (-2.1% surprise).

  6. 3
    2025-05-08EarningsBeat / raise

    Reported EPS 1.51 vs 1.47 expected (+2.9% surprise).

  7. 2
    2025-02-06EarningsBeat / raise

    Reported EPS 1.51 vs 1.41 expected (+7.3% surprise).

  8. 1
    2024-10-31EarningsBeat / raise

    Reported EPS 1.34 vs 1.32 expected (+1.5% surprise).

Earnings history

EPS vs expectations
DateExpected EPSReported EPSSurprise
2026-08-061.691.93+14.2%
2026-05-051.421.42+0.3%
2026-02-191.261.26−0.2%
2025-11-060.870.92+5.9%
2025-08-071.281.25−2.1%
2025-05-081.471.51+2.9%
2025-02-061.411.51+7.3%
2024-10-311.321.34+1.5%
2024-08-081.21.32+10.1%
2024-05-091.081.18+9.3%
2024-02-081.011.06+5.1%
2023-11-090.950.96+1.3%
2023-08-100.840.79−5.5%
2023-05-040.890.92+3.8%
2023-02-091.341.57+17.3%
2022-10-271.311.35+3.2%
2022-08-091.271.28+0.6%
2022-05-031.171.31+12.3%
2022-02-081.111.23+10.8%
2021-11-040.920.98+6.5%
2021-08-050.80.92+14.7%
2021-04-290.680.73+7.3%
2021-02-040.60.72+20.0%
2020-11-020.340.4+17.0%

About Onto Innovation

Website ↗

Onto Innovation Inc. engages in the design, development, manufacture, and support of process control tools that perform macro-defect inspection and metrology in the United States, Taiwan, South Korea, Japan, China, Southeast Asia, Asia, and Europe. The company offers lithography systems and process control analytical software; and automated and integrated metrology systems, silicon wafer all-surface inspection, macro defect inspection, automated defect classification and pattern analysis, yield analysis, opaque film metrology, 4D business, advanced packaging lithography, process control software, and yield management software products. It also provides process and yield management solutions, and device packaging and test facilities through standalone systems for optical metrology, macro-defect inspection, packaging lithography, and transparent and opaque thin film measurements. In additi…

1,867 employees · Wilmington, United States

Gate-all-around transistors, backside power and HBM stacking add process steps. More steps per wafer means more tool spend per unit of capacity.

Deposition→Etch→Inspection→Yield

What would prove us wrong. Weakens if WFE growth stalls while leading-node and HBM capacity keep expanding — tools would not be the gate.

Peers at the same bottleneck

Who else supplies this

StockRoleLast1D1MYTDTrend
AMAT
Applied Materials
Deposition and materials engineering across logic, DRAM and packaging $391.6+3.81%−19.3%+52.9%
LRCX
Lam Research
Etch and deposition critical for GAA and HBM $239.8+4.22%−23.9%+40.5%
KLAC
KLA
Process control and inspection at leading nodes $150.4+3.27%−20.0%+24.2%
8035.T
Tokyo Electron
Coater/developer, etch and deposition tools ¥9,110.0−3.68%−12.5%+38.7%
ASM.AS
ASM International
ALD/epitaxy for gate-all-around transistors €707.8+1.14%−16.2%+37.3%
CAMT
Camtek
Inspection for HBM and advanced packaging $124.9+3.09%−15.1%+17.4%
NVMI
Nova
Dimensional and materials metrology $318.4+2.27%−13.5%−3.0%

Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.