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NASDAQ · US · Semiconductor Equipment & Materials

LRCX Lam Research

Etch and deposition critical for GAA and HBM

Downtrend Trading below its 50-day average. (automatic: supply-chain trend + price vs 50-day average)
Last close (delayed) · 2026-10-26
$239.8
+4.22% today
1W
−11.9%
1M
−23.9%
3M
−11.0%
YTD
+40.5%
1Y
+58.8%
Off 52w high
−44.6%
Next earnings (est.): 2026-10-21
Market cap$288B
P/E (trailing)34.3Forward 19.0
EV / sales10.9×EV/EBITDA 28.1×
Revenue (TTM)$26.13BGrowth 54.4% y/y
Margins51.0%gross · op 40.0%
Free cash flow$4.55BCash $7.44B · debt $3.74B
Analyst target$364.0+51.8% upside · 30 analysts · strong buy
Riskβ 1.85Short 2.1% of float · yield 0.57%

Fundamentals from public market data, refreshed daily (2026-10-24 02:59 UTC). Figures in reporting currency.

LRCX · price with what management and the data said

Supply tighteningBeat / raiseMiss / cutData releaseEasing Hover a numbered marker for details · dashed lines = 50- and 200-day averages

Timeline: management commentary, data & earnings

8 events
  1. 8
    2026-10-21EarningsBeat / raise

    Reported EPS 2.2 vs 2.18 expected (+0.9% surprise).

  2. 7
    2026-07-29EarningsBeat / raise

    Reported EPS 1.82 vs 1.68 expected (+8.1% surprise).

  3. 6
    2026-04-22EarningsBeat / raise

    Reported EPS 1.47 vs 1.36 expected (+7.9% surprise).

  4. 5
    2026-01-28EarningsBeat / raise

    Reported EPS 1.27 vs 1.17 expected (+8.7% surprise).

  5. 4
    2025-10-22EarningsBeat / raise

    Reported EPS 1.26 vs 1.22 expected (+3.3% surprise).

  6. 3
    2025-07-30EarningsBeat / raise

    Reported EPS 1.33 vs 1.21 expected (+10.4% surprise).

  7. 2
    2025-04-23EarningsBeat / raise

    Reported EPS 1.04 vs 1 expected (+4.1% surprise).

  8. 1
    2025-01-29EarningsBeat / raise

    Reported EPS 0.91 vs 0.88 expected (+3.5% surprise).

Predictions involving LRCX

Earnings history

EPS vs expectations
DateExpected EPSReported EPSSurprise
2026-10-212.182.2+0.9%
2026-07-291.681.82+8.1%
2026-04-221.361.47+7.9%
2026-01-281.171.27+8.7%
2025-10-221.221.26+3.3%
2025-07-301.211.33+10.4%
2025-04-231.01.04+4.1%
2025-01-290.880.91+3.5%
2024-10-230.810.86+6.5%
2024-07-310.760.81+7.3%
2024-04-240.730.78+6.8%
2024-01-240.710.75+5.7%
2023-10-180.610.69+11.8%
2023-07-260.510.6+16.5%
2023-04-190.650.7+7.1%
2023-01-251.01.07+7.1%
2022-10-190.951.04+9.2%
2022-07-270.730.88+20.4%
2022-04-200.750.74−1.4%
2022-01-260.850.85+0.2%
2021-10-200.820.84+1.9%
2021-07-280.760.81+6.3%
2021-04-210.660.75+13.4%
2021-01-270.570.6+5.5%

About Lam Research

Website ↗

Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits in the United States, China, Korea, Taiwan, Japan, Southeast Asia, and Europe. The company offers ALTUS systems to deposit conformal or selective films for tungsten or molybdenum metallization applications; SABRE electrochemical deposition products for copper interconnect transition, which support copper damascene manufacturing; Striker single-wafer atomic layer deposition products for dielectric film solutions; and VECTOR plasma-enhanced chemical vapor deposition (CVD) products. It also provides Akara, a conductor etch system designed to enhance etch precision, selectivity, and defect control; Argos, Prevos, and Selis, which are selective etch systems used in the fabrication of advanced logic and memory devices that require …

23,300 employees · Fremont, United States

Gate-all-around transistors, backside power and HBM stacking add process steps. More steps per wafer means more tool spend per unit of capacity.

Deposition→Etch→Inspection→Yield

What would prove us wrong. Weakens if WFE growth stalls while leading-node and HBM capacity keep expanding — tools would not be the gate.

Peers at the same bottleneck

Who else supplies this

StockRoleLast1D1MYTDTrend
AMAT
Applied Materials
Deposition and materials engineering across logic, DRAM and packaging $391.6+3.81%−19.3%+52.9%
KLAC
KLA
Process control and inspection at leading nodes $150.4+3.27%−20.0%+24.2%
8035.T
Tokyo Electron
Coater/developer, etch and deposition tools ¥9,110.0−3.68%−12.5%+38.7%
ASM.AS
ASM International
ALD/epitaxy for gate-all-around transistors €707.8+1.14%−16.2%+37.3%
ONTO
Onto Innovation
Advanced-packaging metrology and lithography $205.6+3.48%−28.5%+30.2%
CAMT
Camtek
Inspection for HBM and advanced packaging $124.9+3.09%−15.1%+17.4%
NVMI
Nova
Dimensional and materials metrology $318.4+2.27%−13.5%−3.0%

Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.